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Impedance matching analysis and EMC validation of a low-cost PCB differential interconnect
(IEEE Latin-American Test Symposium (LATS-2015), 2015-03)
Enhanced procedure to setup the simulation bounding box and the meshing scheme of a 3D finite element EM simulator for planar microwave structures
(IEEE MTT-S International Microwave Symposium Digest, 2015-05)
Temperature Effects in Automotive-Grade High Speed Interconnects
(IEEE, 2016-12)
Space mapping optimization of handset antennas considering EM effects of mobile phone components and human body
(International Journal of RF and Microwave Computer-Aided Engineering, 2016-02)