Search
Now showing items 1-3 of 3
Impedance matching analysis and EMC validation of a low-cost PCB differential interconnect
(IEEE Latin-American Test Symposium (LATS-2015), 2015-03)
Enhanced procedure to setup the simulation bounding box and the meshing scheme of a 3D finite element EM simulator for planar microwave structures
(IEEE MTT-S International Microwave Symposium Digest, 2015-05)
Enhanced formulation for polynomial-based surrogate modeling of microwave structures in frequency domain
(IEEE MTT-S Int. Conf. Num. EM Mutiphysics Modeling Opt. RF, Microw., Terahertz App., 2015-08)