Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration

dc.contributor.advisor	Rhod, Eduardo Luis
dc.contributor.author	Ilha, Bernardo Bortolotto
dc.date.accessioned	2018-10-03T13:26:39Z
dc.date.accessioned	2022-09-22T19:30:23Z
dc.date.available	2018-10-03T13:26:39Z
dc.date.available	2022-09-22T19:30:23Z
dc.date.issued	2018-01-16
dc.identifier.uri	https://hdl.handle.net/20.500.12032/61674
dc.description.sponsorship	UNISINOS - Universidade do Vale do Rio dos Sinos	pt_BR
dc.language	pt_BR	pt_BR
dc.publisher	Universidade do Vale do Rio dos Sinos	pt_BR
dc.rights	openAccess	pt_BR
dc.subject	Sn solder	en
dc.title	Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration	pt_BR
dc.type	Dissertação	pt_BR

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