Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration

Ver/

Bernardo Bortolotto Ilha_.pdf (33.55Mb)

Fecha

2018-01-16

Autor

Ilha, Bernardo Bortolotto

Metadatos

Mostrar el registro completo del ítem

URI

https://hdl.handle.net/20.500.12032/61674

Descripción

UNISINOS - Universidade do Vale do Rio dos Sinos

Colecciones

Documentos - UNISINOS