Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration

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Bernardo Bortolotto Ilha_.pdf (33.55Mb)

Date

2018-01-16

Author

Ilha, Bernardo Bortolotto

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https://hdl.handle.net/20.500.12032/61674

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UNISINOS - Universidade do Vale do Rio dos Sinos

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