Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration

View/Open

Bernardo Bortolotto Ilha_.pdf (33.55Mb)

Date

2018-01-16

Author

Ilha, Bernardo Bortolotto

Metadata

Show full item record

Description

UNISINOS - Universidade do Vale do Rio dos Sinos

Collections

Documentos - UNISINOS