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dc.contributor.authorCervantes-González, Juan C.
dc.contributor.authorLópez, Carlos A.
dc.contributor.authorRayas-Sánchez, José E.
dc.contributor.authorBrito-Brito, Zabdiel
dc.contributor.authorHernández-Sosa, Gaudencio
dc.date.accessioned2016-01-12T17:32:01Z
dc.date.accessioned2023-03-10T16:56:48Z
dc.date.available2023-03-10T16:56:48Z
dc.date.issued2013-08
dc.identifier.citationCervantes-González, J.C.; López, C.A.; Rayas-Sánchez, J.E.; Brito-Brito, Z, and Hernández-Sosa, G. (2013). “Return-loss minimization of package interconnects through input space mapping using FEM-based models,” in Proc. SBMO/IEEE MTT-S Int. Microwave Optoelectronics Conf. (IMOC-2013), Rio de Janeiro, Brazil, Aug. 2013, pp. 1-4.es
dc.identifier.isbn978-1-4799-1397-8
dc.identifier.otherDOI: 10.1109
dc.identifier.urihttps://hdl.handle.net/20.500.12032/69713
dc.descriptionHighly efficient CAD methodologies based on full-wave EM analysis, for the design of package interconnects are necessary due to the increased frequencies of operation and a desire of faster time-to-market. In this work, we exploit a Broyden-based input space mapping (SM) algorithm with both fine and coarse models implemented with the finite-element method (FEM), to efficiently optimize design parameters of a modern package interconnect. This optimization algorithm has been applied to a single-ended package line resulting in a significant decrease of the return loss in the 5-10 GHz range, requiring just a few fine model evaluations.es
dc.description.sponsorshipITESO, A.C.es
dc.description.sponsorshipIntel Labses
dc.language.isoenges
dc.publisherSBMO/IEEE MTT-S International Microwave Optoelectronics Conference (IMOC-2013)es
dc.relation.ispartofseriesProceedings of the SBMO/IEEE MTT-S International Microwave Optoelectronics Conference;IMOC-2013
dc.rights.urihttp://quijote.biblio.iteso.mx/licencias/CC-BY-NC-ND-2.5-MX.pdfes
dc.subjectSpace Mappinges
dc.subjectPackage Interconnectses
dc.subjectEM-based Design Optimizationes
dc.subjectHigh-speedes
dc.subjectReturn-losses
dc.subjectFEM Space Mappinges
dc.titleReturn-loss minimization of package interconnects through input space mapping using FEM-based modelses
dc.typeinfo:eu-repo/semantics/conferencePaperes


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