Return-loss minimization of package interconnects through input space mapping using FEM-based models
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Data
2013-08Autor
Cervantes-González, Juan C.
López, Carlos A.
Rayas-Sánchez, José E.
Brito-Brito, Zabdiel
Hernández-Sosa, Gaudencio
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Highly efficient CAD methodologies based on full-wave EM analysis, for the design of package interconnects are necessary due to the increased frequencies of operation and a desire of faster time-to-market. In this work, we exploit a Broyden-based input space mapping (SM) algorithm with both fine and coarse models implemented with the finite-element method (FEM), to efficiently optimize design parameters of a modern package interconnect. This optimization algorithm has been applied to a single-ended package line resulting in a significant decrease of the return loss in the 5-10 GHz range, requiring just a few fine model evaluations.ITESO, A.C.
Intel Labs