| dc.contributor.author | Del-Rey, Juan R. | |
| dc.contributor.author | Brito-Brito, Zabdiel | |
| dc.contributor.author | Rayas-Sánchez, José E. | |
| dc.contributor.author | Izquierdo, Nicolás | |
| dc.date.accessioned | 2019-07-23T16:15:45Z | |
| dc.date.accessioned | 2023-03-21T18:36:09Z | |
| dc.date.available | 2023-03-21T18:36:09Z | |
| dc.date.issued | 2016-12 | |
| dc.identifier.citation | J. R. Del-Rey, Z. Brito-Brito, J. E. Rayas-Sánchez, and N. Izquierdo, “Temperature effects in automotive-grade high speed interconnects,” in IEEE MTT-S Latin America Microwave Conf. (LAMC-2016), Puerto Vallarta, Mexico, Dec. 2016, pp. 1-4. DOI: 10.1109/LAMC.2016.7851273. | es |
| dc.identifier.isbn | 978-1-5090-4288-3 | |
| dc.identifier.uri | https://hdl.handle.net/20.500.12032/74506 | |
| dc.description | This work discerns the frequency response (up to 15 GHz) of several automotive-grade microstrip transmission line structures over a temperature span from -40 to 105 Celsius degrees. To ensure precise measurements, S-parameter responses from several test PCBs based on Cu over FR4 substrate are attained through a vector network analyzer in a controlled environment. Results show that temperature has a major impact on these high speed interconnects in frequencies above a few GHz, setting the need of employing accurate multi-physical models. | es |
| dc.language.iso | eng | es |
| dc.publisher | IEEE | es |
| dc.rights.uri | http://quijote.biblio.iteso.mx/licencias/TodosLosDerechosReservados.pdf | es |
| dc.subject | Automotive Boards | es |
| dc.subject | High-speed Interconnects | es |
| dc.subject | Temperature Effects | es |
| dc.title | Temperature Effects in Automotive-Grade High Speed Interconnects | es |
| dc.type | info:eu-repo/semantics/conferencePaper | es |
