dc.contributor.author | Del-Rey, Juan R. | |
dc.contributor.author | Brito-Brito, Zabdiel | |
dc.contributor.author | Rayas-Sánchez, José E. | |
dc.contributor.author | Izquierdo, Nicolás | |
dc.date.accessioned | 2019-07-23T18:20:18Z | |
dc.date.accessioned | 2023-03-21T16:40:57Z | |
dc.date.available | 2019-07-23T18:20:18Z | |
dc.date.available | 2023-03-21T16:40:57Z | |
dc.date.issued | 2016-12 | |
dc.identifier.citation | J. R. Del-Rey, Z. Brito-Brito, J. E. Rayas-Sánchez, and N. Izquierdo, “Temperature effects in automotive-grade high speed interconnects,” in IEEE MTT-S Latin America Microwave Conf. (LAMC-2016), Puerto Vallarta, Mexico, Dec. 2016 (poster) | es |
dc.identifier.isbn | 978-1-5090-4288-3 | |
dc.identifier.uri | https://hdl.handle.net/20.500.12032/73646 | |
dc.description | This work discerns the frequency response (up to 15 GHz) of several automotive-grade microstrip transmission line structures over a temperature span from -40 to 105 Celsius degrees. To ensure precise measurements, S-parameter responses from several test PCBs based on Cu over FR4 substrate are attained through a vector network analyzer in a controlled environment. Results show that temperature has a major impact on these high speed interconnects in frequencies above a few GHz, setting the need of employing accurate multi-physical models. | es |
dc.language.iso | eng | es |
dc.publisher | IEEE | es |
dc.rights.uri | http://quijote.biblio.iteso.mx/licencias/CC-BY-NC-ND-2.5-MX.pdf | es |
dc.subject | FR4 | es |
dc.subject | Microstrip | es |
dc.subject | PCB | es |
dc.subject | Thermal Effects | es |
dc.subject | Transmission Lines | es |
dc.subject | VNA | es |
dc.subject | Environmental Chamber | es |
dc.title | Temperature Effects in Automotive-Grade High Speed Interconnects (poster) | es |
dc.type | info:eu-repo/semantics/conferencePoster | es |