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dc.contributor.authorDel-Rey, Juan R.
dc.contributor.authorBrito-Brito, Zabdiel
dc.contributor.authorRayas-Sánchez, José E.
dc.contributor.authorIzquierdo, Nicolás
dc.date.accessioned2019-07-23T18:20:18Z
dc.date.accessioned2023-03-21T16:40:57Z
dc.date.available2019-07-23T18:20:18Z
dc.date.available2023-03-21T16:40:57Z
dc.date.issued2016-12
dc.identifier.citationJ. R. Del-Rey, Z. Brito-Brito, J. E. Rayas-Sánchez, and N. Izquierdo, “Temperature effects in automotive-grade high speed interconnects,” in IEEE MTT-S Latin America Microwave Conf. (LAMC-2016), Puerto Vallarta, Mexico, Dec. 2016 (poster)es
dc.identifier.isbn978-1-5090-4288-3
dc.identifier.urihttps://hdl.handle.net/20.500.12032/73646
dc.descriptionThis work discerns the frequency response (up to 15 GHz) of several automotive-grade microstrip transmission line structures over a temperature span from -40 to 105 Celsius degrees. To ensure precise measurements, S-parameter responses from several test PCBs based on Cu over FR4 substrate are attained through a vector network analyzer in a controlled environment. Results show that temperature has a major impact on these high speed interconnects in frequencies above a few GHz, setting the need of employing accurate multi-physical models.es
dc.language.isoenges
dc.publisherIEEEes
dc.rights.urihttp://quijote.biblio.iteso.mx/licencias/CC-BY-NC-ND-2.5-MX.pdfes
dc.subjectFR4es
dc.subjectMicrostripes
dc.subjectPCBes
dc.subjectThermal Effectses
dc.subjectTransmission Lineses
dc.subjectVNAes
dc.subjectEnvironmental Chamberes
dc.titleTemperature Effects in Automotive-Grade High Speed Interconnects (poster)es
dc.typeinfo:eu-repo/semantics/conferencePosteres


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