| dc.description.abstract | The generation of waste is direct related with the ecological balance and with man own survival. The present consumer society of today also has the habit to extract raw material which is transformed in different products and after used the exceeding they are discarded in appropriate areas, attributing a predatory relation with the environment. Then, these big quantities of recycled products that could be useful from the waste generation are useless or worthless in its end. In this context it worth to remind that the agricultural and industrial sectors are big generators of waste throughout of the Rice Husk (RH), when this becomes energy generating exceed for Rice Husk Ashes (RHA). On the face of this reality is propose a study about the utilization of the (RHA), natural residual originated from the burn of Rice Husk (RH), in the production of “composites” using “thermoset” like matrixes, simplifying its recycling and in simultaneously promoting the production of new products has commercial use and value associated. Assuming so, we aim to point out the utility of using “composites” (RHA) to elaborate a study aimed the use of “composites” as raw material to cover semiconductors. For this aspect of the study, it worth to, of the chemical and physical properties of the composites of “Epoxy” with natural “silica, which is raw material to cover semiconductors. According to the test results of raw materials and of composites CCA and natural silica and concluded that the properties of the two materials are similar, with some differences as viscosity, water absorption, tensile and flexural wherein the of CCA for these assays are larger compared to natural silica. The control of these properties, such as a particle size suitable for CCA a viscosity close to natural silica, the use of CCA in the form of crystalline structure which favors a more compact form, thus reducing the tendency for water absorption are ways of approximating the characteristics CCA with natural silica, resulting in the possibility of using silica CCA substituting natural raw materials for semiconductor encapsulation. | en |
