Description
© 2001-2011 IEEE.This paper addresses a quantitative study of the reliability improvement of the stacked transistor structure. The susceptibility of integrated circuits to single-event effects caused by interaction with ionizing particles is analyzed at the semiconductor level, as well as at the device and circuit levels considering the replacement of each transistor by a stacked silicon-on-insulator (SOI) array. Up-To-date technologic nodes were used as inputs for the simulation and reliability models. A stochastic Markov model was proposed and evaluated. The model output pointed the stacked array as a real alternative for high-reliability in future applications, with exceptional results. For a 10^{5} device-count integrated circuit, a success probability of 80% is reached for missions over 100 000 h in the commercial flights altitude, while for the single transistor system, this value is reached for missions under 100 h.
